Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
TGL180 is a curable thermal conductive gel engineered for heat-dissipation assembly of electronic components. Utilizing a proprietary filler-compounding formula and specialized manufacturing process, it incorporates diamond powder as the thermal-conductive filler to achieve ultra-high thermal conductivity, delivering excellent interfacial heat transfer and gap-filling capability. Low interfacial thermal resistance can be achieved at a relatively low pressure. It can be used between heating power devices and radiating aluminum sheets or shells to effectively eliminate the air, thereby reducing air contact thermal resistance and achieving an effective filling effect.
Optical Modules, AI Computing Systems, New Energy Vehicle (NEV) Electronics, Power Semiconductors & High-End Energy Storage, High-End Communication RF Equipment
| Property | Item | Unit | Typical Value | Test Standard |
|---|---|---|---|---|
| Composition | / | / | Silicone-based with diamond powder | / |
| Thermal Properties | Thermal Conductivity | W/m?K | 18 | ASTM D5470 |
| Thermal Resistance@40Psi | Ω·cm2/W | 0.143 | ASTM D5470 | |
| Physical Properties | Color | / | Gray | Visual Inspection |
| Density | g/cm3 | 3.25 | ASTM D792 | |
| Hardness | Shore 00 | 60 | ASTM D2240 | |
| BLT | um | 190 | ASTM D374 | |
| Electrical Properties | Breakdown Voltage @1mm | kV | 8.0 | ASTM D149 |
| Volume Resistance | Ω·cm | 1012 | GB/T 1410 | |
| Other Properties | Flow Rate@0.5Mpa | g/min | 0.9 | SG Internal Method |
| Flame Retardant Rating | / | V0 | UL94 | |
| Curing Time@130? | min | 30 | SG Internal Method |
