ShielditeTM WP series conductive PI over foam materials consist of a highly conductive Cu/Ni Plated PI, a PU foam
core, and a conductive pressure-sensitive acrylic adhesive. These highly compressible materials are specifically
designed to provide excellent EMI shielding and grounding performance coupled with high degree dust and
moisture protection. WP series products are particularly suitable for fixed-gasket applications within computers,
smartphones, LCDs/TVs and telecommunication manufacturing sectors as they are easily trimmed to size.
Reflow solderable gasket can be customised by request.