Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
PolyplateTM TSP-G Series Silicone-Based Thermal Pad is filled with carbon fibers in high density through the thickness of a polymer matrix. It has ultra-high thermal conductivity of 15W/m·K and 38W/m·K. It also offers high compressibility, softness, and flexibility.
| Item | Unit | TSP150G | TSP380G | Test Method |
|---|---|---|---|---|
| Composition | / | Silicone & Carbon Fiber | / | |
| Thickness | mm | 1.0~5.0 | ASTM D374 | |
| Density | g/cm³ | 2.2 | 2.0 | ASTM D792 |
| Hardness | Shore 00 | 45 | 45 | ASTM D2240 |
| Volume Resistivity | Ω·cm | <500 | ASTM D257 | |
|
Continuous Use Temperature |
°C | -40~200 | / | |
| Weight Loss | % | ≤0.3 | @150℃240H | |
| Flame Rating | / | V0 | UL 94 | |
| Thermal Conductivity | W/m·K | 15 | 38 | ASTM D5470 |
