TPC Series Thermal Phase Change Material

Polyplate^TM TPC Series is a high-performance thermal phase change material (TPCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. The series are inherently tacky, flexible, and exceptionally easy-to-use. They can fill irregular spaces between electronic components and heat sinks.

Product Description

SG Polyplate^TMTPC series are high-performance thermal phase change material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. TPC series has good fluidity and wettability above the phase change point. The series are inherently tacky, flexible and exceptionally easy-to-use. They can fill irregular surfaces between electronic component and heat sink. TPC series are used in common applications including NB/PC/Tablet PC, LED lighting, power supply, graphic card thermal modules, telecommunications, automotive and consumer electronics.

Typical Product Properties

Properties	Unit	TPC035	TPC045	TPC080	Test Method
Color	/	Gray			Visual
Thickness	mm	0.1-0.45			ASTM D374
Specific Gravity	g/cm³	2.40	2.40	2.65	ASTM D792
Thermal Resistance（@20psi）	℃·in²/W	0.056	0.039	0.006	ASTM D5470
Thermal Conductivity	W/m·k	3.5	4.5	8.0	ASTM D5470
Phase Change Point	℃	45			ASTM E794
Usage Temperature	℃	-40~120			SG Method

Thermal Resistance Curve

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