Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
SG PolyplateTM TPC series are high-performance thermal phase change material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. TPC series has good fluidity and wettability above the phase change point. The series are inherently tacky, flexible and exceptionally easy-to-use. They can fill irregular surfaces between electronic component and heat sink. TPC series are used in common applications including NB/PC/Tablet PC, LED lighting, power supply, graphic card thermal modules, telecommunications, automotive and consumer electronics.
| Properties | Unit | TPC035 | TPC045 | TPC065 | Test Method |
| Color | / | Gray | Visual | ||
| Thickness | mm | 0.1-0.45 | ASTM D374 | ||
| Specific Gravity | g/cm3 | 2.4 | 2.4 | 2.5 | ASTM D792 |
| Thermal Resistance（@20psi） | ℃·in2/W | 0.056 | 0.039 | 0.013 | ASTM D5470 |
| Thermal Conductivity | W/m·k | 3.5 | 4.5 | 6.5 | |
| Phase Change Point | ℃ | 45 | ASTM E794 | ||
| Usage Temperature | ℃ | -40~120 | SG Method | ||
