SG PolyplateTM TPC series are high-performance thermal phase change material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. TPC series has good fluidity and wettability above the phase change point. The series are inherently tacky, flexible and exceptionally easy-to-use. They can fill irregular surfaces between electronic component and heat sink. TPC series are used in common applications including NB/PC/Tablet PC, LED lighting, power supply, graphic card thermal modules, telecommunications, automotive and consumer electronics.
|Specific Gravity||g/cm3||2.4||2.4||2.5||ASTM D792|
|Thermal Resistance（@20psi）||℃·in2/W||0.056||0.039||0.013||ASTM D5470|
|Phase Change Point||℃||45||ASTM E794|
|Usage Temperature||℃||-40~120||SG Method|