Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
SG PolyplateTM TPC series are high-performance thermal phase change material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. TPC series has good fluidity and wettability above the phase change point. The series are inherently tacky, flexible and exceptionally easy-to-use. They can fill irregular surfaces between electronic component and heat sink. TPC series are used in common applications including NB/PC/Tablet PC, LED lighting, power supply, graphic card thermal modules, telecommunications, automotive and consumer electronics.
PolyplateTM TPC Series is a high-performance thermal phase change material (TPCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. The series are inherently tacky, flexible, and exceptionally easy-to-use. They can fill irregular spaces between electronic components and heat sinks.
| Item | Unit | TPC035 | TPC045 | TPC085 | Test Method |
| Composition | / | Synthetic Paraffin & Ceramic | / | ||
| Color | / | Gray | Visual | ||
| Density | g/cm³ | 2.3 | 2.45 | 2.65 | ASTM D792 |
| Thickness | mm | 0.1/0.20/30.4 | ASTM D374 | ||
| Thermal Conductivity | W/m·K | 3.5 | 4.5 | 8.5 | ASTM D5470 |
| Thermal Impedance @30psi | ℃·in²/W | 0.019 | 0.015 | 0.006 | ASTM D5470 |
| Phase change Point | ℃ | 45 | / | ||
| Continuous Use Temperature | ℃ | -25~125 | / | ||
Note: The phase change point can be customized in the range from 45℃ to 60℃
