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TPC Series Thermal Phase Change Material
PolyplateTM TPC Series is a high-performance thermal phase change material (TPCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. The series are inherently tacky, flexible, and exceptionally easy-to-use. They can fill irregular spaces between electronic components and heat sinks.

Product Description


SG PolyplateTM TPC series are high-performance thermal phase change material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. TPC series has good fluidity and wettability above the phase change point. The series are inherently tacky, flexible and exceptionally easy-to-use. They can fill irregular surfaces between electronic component and heat sink. TPC series are used in common applications including NB/PC/Tablet PC, LED lighting, power supply, graphic card thermal modules, telecommunications, automotive and consumer electronics.


Typical Product Properties


Properties Unit TPC035 TPC045 TPC080 Test Method
Color / Gray Visual
Thickness mm 0.1-0.45 ASTM D374
Specific Gravity g/cm3 2.40 2.40 2.65 ASTM D792
Thermal Resistance@20psi ℃·in2/W 0.056 0.039 0.006 ASTM D5470
Thermal Conductivity W/m·k 3.5 4.5 8.0
Phase Change Point 45 ASTM E794 
Usage Temperature -40~120 SG Method


Thermal Resistance Curve




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