Features
- High thermal conductivity and ultra low thermal impedance
- Low compression stress
- Good flowability and wettability for reducing thermal resistance effectively
- Highly conformable to uneven and rough surfaces
- Compliance with RoHS requirements
- Long term stability and reliability
- Compatible with Form-in-Place Machine
- Easy for assembly and reworkable
Applications
- High power CPU & GPU
- Optical device
- Power conversion module
- Power transistor
- Server
- Telecommunication device
- High power LED lighting
- Consumer electronics
