Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
TGL120DF is a curable thermal conductive gel engineered for heat-dissipation assembly of electronic components. It achieves high thermal conductivity through a specialized filler-compounding system and proprietary manufacturing process. Without a diamond formulation, it maintains reliable thermal performance while optimizing material cost and process compatibility. Low interfacial thermal resistance can be achieved at a relatively low pressure. It can be used between heating power devices and radiating aluminum sheets or shells to effectively eliminate the air, thereby reducing air contact thermal resistance and achieving an effective filling effect.
Optical Modules, AI Computing Systems, New Energy Vehicle (NEV) Electronics, Power Semiconductors & High-End Energy Storage, High-End Communication RF Equipment
| Property | Item | Unit | TGL120DF | Test Standard |
|---|---|---|---|---|
| Composition | / | / | Silicone-based, Diamond-free | / |
| Thermal Properties | Thermal Conductivity | W/m?K | 12 | ASTM D5470 |
| Thermal Resistance@40Psi | Ω·cm2/W | 0.200 | ASTM D5470 | |
| Physical Properties | Color | / | Blue | Visual Inspection |
| Density | g/cm3 | 3.2 | ASTM D792 | |
| Hardness | Shore 00 | 60 | ASTM D2240 | |
| BLT | um | 190 | ASTM D374 | |
| Electrical Properties | Breakdown Voltage @1mm | kV | 8.0 | ASTM D149 |
| Volume Resistance | Ω·cm | 1012 | GB/T 1410 | |
| Other Properties | Flow Rate@0.5Mpa | g/min | 0.9 | SG Internal Method |
| Flame Retardant Rating | / | V0 | UL94 | |
| Curing Time@130? | min | 30 | SG Internal Method |
