Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
Thermal Pad Working Mechanism
Production Line
Test Method and Equipment
Technology Superiority
◆ High thermal conductivity
◆ Specialized silicone chemistry provides good electrical insulation
◆ Precise coating and hot-press molding technology
◆ Good thermal stability whatever ultra-thin or ultra-thick material
◆ Rapid and efficient service for making sample and die-cutting
◆ Instant customization in color, thickness, hardness or thermal conductivity
◆ Can be laminated with adhesive upon request
◆ Can be one-sided tacky upon request
Product Superiority
◆ Instant customization for thickness ( 0.1mm ~~ 15.0 mm) and color
◆ Special fillers to achieve specific thermal conductivity: 1.5 W/(m.K) ~~ 17 W/(m.K)
◆ Good electrically insulation, withstand voltage exceed 10(KV/mm), up to 17(KV/mm)
◆ Offer excellent conformability to cover uneven and rough surfaces
◆ Easy to fit diversified gap conditions. Avoid hard contact and protect IC chips
◆ Elastomeric property to provide mechanism balance
◆ Adhesive or natural self-tacky to stick on heat sink
Product Structure
◆ Base material: Silicone
◆ Filler: Boron nitride, Diamond, Aluminum nitride, Aluminum oxide, etc.
◆ Flame resistance: Metal hydroxide
◆ Additive: Colorant, Catalyst
Application Design
PolyplateTM TSP20 and TSP30 are cost effective silicone thermal conductive pads with low compression force, low thermal resistance, ultra-soft performance and high conformability for applications. PolyplateTM TSP20H and TSP30H are composite fiberglass reinforced thermal conductive pads with the performance of high tear strength, puncture resistance, and easy assembly, can be widely used in new energy vehicles.
| Item | Unit | TSP20 | TSP30 | TSP20H | TSP30H | Test Method |
| Composition | / | Silicone & Ceramic | Silicone & Ceramic & Fiberglass | / | ||
| Thickness | mm | 0.3~12.0 | ASTM D374 | |||
| Density | g/cm³ | 2.7 | 2.9 | 2.7 | 2.9 | ASTM D792 |
| Hardness | Shore 00 | 25~60 | 30~65 | 30~70 | 35~75 | ASTM D2240 |
| Dielectric Strength | KV/mm | >6.0 | ASTM D149 | |||
| Volume Resistivity | Ω·cm | >10¹¹ | ASTM D257 | |||
| Continuous Use Temperature | ℃ | -40~200 | / | |||
| Weight Loss | % | ≤0.5 | @150℃240H | |||
| Flame Rating | / | V0 | UL 94 | |||
| Thermal Conductivity | W/m·K | 2 | 3 | 2 | 3 | ASTM D5470 |
| Dielectric Constant@1MHz | / | 6.0~7.5 | ASTM D150 | |||
PolyplateTM TSP40, TSP50, TSP60, TSP70 are silicone thermal pads with high performance and provide thermal solutions for filling the air gap between the electronic component and heat sink. They offer high compressibility, tacky surface, softness, and flexibility.
| Item | Unit | TSP40 | TSP50 | TSP60 | TSP70 | Test Method |
| Composition | / | Silicone & Ceramic | / | |||
| Thickness | mm | 0.3~12.0 | ASTM D374 | |||
| Density | g/cm³ | 3.1 | 3.2 | 3.2 | 3.3 | ASTM D792 |
| Hardness | Shore 00 | 30~70 | ASTM D2240 | |||
| Dielectric Strength | KV/mm | >6.0 | >6.0 | >6.0 | >6.0 | ASTM D149 |
| Volume Resistivity | Ω·cm | >10¹¹ | >10¹¹ | >10¹¹ | >10¹¹ | ASTM D257 |
| Continuous Use Temperature | ℃ | -40~200 | -40~200 | -40~200 | -40~200 | / |
| Weight Loss | % | <0.5 | <0.5 | <0.5 | <0.5 | @150℃240H |
| Flame Rating | / | V0 | V0 | V0 | V0 | UL 94 |
| Thermal Conductivity | W/m·K | 4 | 5 | 6 | 7 | ASTM D5470 |
| Dielectric Constant@1MHz | / | 7.5 | 7.4 | 7.9 | 7.1 | ASTM D150 |
PolyplateTM TSP120, TSP140 and TSP170 Silicone-Based Thermal Pads have ultra-high thermal conductivity and provide thermal solutions for filling the air gap between the electronic component and heat sink. They offer high compressibility, tacky surface, softness, and flexibility.
| Item | Unit | TSP120 | TSP140 | TSP170 | Test Method |
| Composition | / | Silicone & Ceramic | / | ||
| Thickness | mm | 0.3~2.0 | ASTM D374 | ||
| Density | g/cm³ | 3.3 | 3.4 | 3.4 | ASTM D792 |
| Hardness | Shore 00 | 60±5 | 65±5 | 70±5 | ASTM D2240 |
| Dielectric Strength | KV/mm | >6.0 | ASTM D149 | ||
| Volume Resistivity | Ω·cm | >10¹¹ | ASTM D257 | ||
| Continuous Use Temperature | ℃ | -40~200 | / | ||
| Weight Loss | % | >0.5 | @150℃240H | ||
| Flame Rating | / | V0 | UL 94 | ||
| Thermal Conductivity | W/m·K | 12 | 14 | 17 | ASTM D5470 |
| Dielectric Constant@1MHz | / | 7.5 | 7.4 | 7.7 | ASTM D150 |
