Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
TCG Series Thermal Grease is a high thermally conductive compound with low thermal resistance for components that require improved thermal dissipation. It is ideally suitable for use in CPU, GPU cooling and other applications between power semiconductor components and heat sinks where thermal resistance is the major concern.
| Item | Unit | TCG15 | TCG30 | TCG60 | TCG85 | Test Method |
| Composition | / | Silicone & Ceramic | Silicone & Metal | / | ||
| Density | g/cm³ | 2.2 | 2.7 | 2.9 | 3.2 | ASTM D792 |
| Viscosity | Pa·s | 16.5 | 320 | 500 | 750 | ASTM D2196 |
| Thermal Conductivity | W/m·K | 1.5 | 3 | 6 | 8.5 | ASTM D5470 |
|
Thermal Impedance @50psi |
℃·in²/W | 0.05 | 0.035 | 0.01 | 0.008 | ASTM D5470 |
| Dielectric Strength | KV/mm | 6 | 5 | 5 | 5 | ASTM D149 |
| Volume Resistivity | Ω·cm | >10¹¹ | >10¹¹ | ASTM D257 | ||
| Weight Loss | % | <0.5 | <0.5 | <0.5 | <0.5 | @150℃, 24H |
|
Continuous Use Temperature |
℃ | -60~180 | / | |||
