Products
Foam Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
Shieldite™ CPOSP Series conductive foam consist of metal plated urethane foam, conductive fabric and copper foil with conductive pressure sensitive acrylic adhesive. This highly compressible material is specifically engineered to provide EMI shielding and grounding through X,Y and Z axes. CPOSP Series has reliable electrical performance over wide range of gap distances from soft foam construction.
| Properties | Unit | Parameter | ||||
|---|---|---|---|---|---|---|
| Model Number | CPOSF | CPO020SF | CPO030SF | CPO050SF | CPO070SF | CPO100SF |
| Total Thickness | mm | 0.2 | 0.3 | 0.5 | 0.7 | 1.0 |
| Component | / | Conductive Foam / Copper Foil | ||||
| Compressibility | % | >70 | ||||
| Heat Resistance | ℃ | 80-260 | ||||
| Shielding Effectiveness | dB | ≥60 (10MHz-20GHz) | ||||
| 180° Peel Strength | N/25mm | >10 | ||||
| XY- Resistance | ohms | ≤0.1 | ||||
| Z- Resistance | ohms | ≤0.1 | ||||
|
Compression Set (Heat Aged70 ℃/22H) |
% | 5 | ||||
|
Compression Set (80000Cycles Compress Test, 50%Compression Ratio) |
% | 5 | ||||
| Color | Silver Gray / Black | |||||
Note: The thickness can be customized by request
