Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
TGL150DF is a curable thermal conductive gel, silicone-resin-based. It adopts proprietary formula and manufacturing process and features a without diamond filler system. Low interfacial thermal resistance can be achieved at a relatively low pressure. It can be used between heating power devices and radiating aluminum sheets or shells to effectively eliminate the air, thereby reducing air contact thermal resistance and achieving an effective filling effect.
Optical Modules, AI Computing Systems, New Energy Vehicle (NEV) Electronics, Power Semiconductors & High-End Energy Storage, High-End Communication RF Equipment
| Property | Item | Unit | Typical Value | Test Standard |
|---|---|---|---|---|
| Composition | / | / | Silicone-based, Diamond-free | / |
| Thermal Properties | Thermal Conductivity | W/m?K | 15 | ASTM D5470 |
| Thermal Resistance@40Psi | Ω·cm2/W | 0.188 | ASTM D5470 | |
| Physical Properties | Color | / | Gray | Visual Inspection |
| Density | g/cm3 | 3.2 | ASTM D792 | |
| Hardness | Shore 00 | 60 | ASTM D2240 | |
| BLT | um | 190 | ASTM D374 | |
| Electrical Properties | Breakdown Voltage @1mm | kV | 8.0 | ASTM D149 |
| Volume Resistance | Ω·cm | 1012 | GB/T 1410 | |
| Other Properties | Flow Rate@0.5Mpa | g/min | 0.65 | SG Internal Method |
| Flame Retardant Rating | / | V0 | UL94 | |
| Curing Time@130? | min | 30 | SG Internal Method |
