Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
PolyplateTM TNP Series is silicone-free thermal pads with ultra-high thermal conductivity and provide a thermal solution for filling the air gap between the silicone oil sensitive electronic component and heat sink. It offers high compressibility, tacky surface, softness and flexibility. These kinds of thermal pads can prevent electronic components from being polluted by silicone oil.
| Item | Unit | TNP15 | TNP30 | TNP50 | Test Method |
|---|---|---|---|---|---|
| Composition | / | Elastomer & Ceramic | / | ||
| Thickness | mm | 0.5~10.0 | ASTM D374 | ||
| Density | g/cm³ | 2.5 | 3.0 | 3.2 | ASTM D792 |
| Hardness | Shore 00 | 75±5 | 80±5 | 75±5 | ASTM D2240 |
| Dielectric Strength | KV/mm | >6.0 | ASTM D149 | ||
| Volume Resistivity | Ω·cm | >10¹¹ | ASTM D257 | ||
| Continuous Use Temperature | °C | -40~150 | / | ||
| Weight Loss | % | <0.3 | @150℃ 240H | ||
| Flame Rating | / | V0 | UL 94 | ||
| Thermal Conductivity | W/m·K | 1.5 | 3.0 | 5.0 | ASTM D5470 |
| Dielectric Constant@1MHz | / | 5.7 | 7.0 | 8.0 | ASTM D150 |
