Products
EMI/EMC Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
modern RF devices, reducing PIM has become exceptionally challenging.
resistance, helping to minimize PIM and maximize signal integrity.
Features
P/N
Thickness(um)
Color
180°Peel Strength-SUS (N/cm)
PSA Resistance -XY(Ω/□)
Resistance -Z(Ω)
Hx3 @2460MHz (30dBm)-Al (dBm)
IM3 @869-894MHz (30dBm)-Al (dBm)
SG 8507
20
Grey
3.5
0.1
0.05
-118
-100
SG 2002
20
Grey
2
0.1
0.05
-117
-100
SG 8517-1
30
Grey
3.5
0.1
0.05
-114
-100
SG 2130F
130
Grey
8
0.1
0.05
-110
/
SG 2130F-R
130
Grey
8
0.1
0.05
-110
/
|
Features P/N |
Thickness (um) |
Color |
180°Peel Strength-SUS (N/cm) |
PSA Resistance- XY(Ω/□) |
Resistance-Z (Ω) |
Hx3 @2460MHz (30dBm)-PC (dBm) |
|---|---|---|---|---|---|---|
| SG 67702-18 | 20 | Grey | 3.5 | 0.1 | 0.05 | -118 |
| SG 67702-30HU | 30 | Grey | 3.5 | 0.1 | 0.05 | -117 |
| SG CFU045DB-DN | 45 | Grey | 3.5 | 0.1 | 0.05 | -114 |
| SG CFU045DB-S1 | 50 | Black | 8 | 0.1 | 0.05 | -110 |
|
Features P/N |
Thickness (um) |
Color |
180°Peel Strength-SUS (N/cm) |
PSA Resistance- XY(Ω/□) |
Resistance -Z(Ω) |
Hx3 @2460MHz (30dBm)-Al- Compress 70% (dBm) |
|---|---|---|---|---|---|---|
| SG EM-POS Series | 500 | Grey | >4 | ≤0.5 | ≤0.5 | -96 |
| SG EM-CPOS Series | 350 | Grey | >4 | ≤0.1 | ≤0.1 | -93 |
| SG EM-POSF Series | 600 | Grey | >4 | ≤0.5 | ≤0.5 | -102 |
| SG EM-CPOSF Series | 570 | Grey | >4 | ≤0.1 | ≤0.1 | -98 |
