Products
Foam Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
Polyplate™ Microcellular Polymer Foam S0 Series is an ultra-soft, low density, slow rebound foam for cushioning,protective sealing, and long-term gap filling in electronic devices. It can reach 80% compression ratio. S0 Series foam has very low compression set, high sealing performance, and excellent impact absorption, even on uneven surfaces.
| P/N |
Thickness With Liner (mm) |
Density (kg/m3 ) |
25% Compression Force Deflection (psi) |
Compression Set (%) |
Suggested Max. Compression Ratio (%) |
Dimensional Stability (%) |
Continuous Use Temperature (℃ ) |
|---|---|---|---|---|---|---|---|
| PF040-S0 | 0.4 | 150 | 1.7 | <3 | 80 | ±2 | 70 |
| PF050-S0 | 0.5 | 150 | 1.7 | <3 | 80 | ±2 | 70 |
| PF070-S0 | 0.7 | 150 | 1.8 | <3 | 80 | ±2 | 70 |
| PF100-S0 | 1.0 | 150 | 1.8 | <3 | 80 | ±2 | 70 |
| PF150-S0 | 1.5 | 150 | 2.0 | <3 | 80 | ±2 | 70 |
| PF200-S0 | 2.0 | 150 | 2.7 | <3 | 80 | ±2 | 70 |
| PF300-S0 | 3.0 | 150 | 1.5 | <3 | 80 | ±2 | 70 |
| Test Method | ASTM D3574 | ASTM D3574 | ASTM D3574 | SAE J-2236 |
Note: The thickness can be customized by request
