Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
|
Product P/N |
Total Thickness (μm) |
Type | Carrier |
180° Peel Strength (N/25mm,SUS) |
Color |
Thermal Conductivity Z- W(m·k) |
Thermal Conductivity Xy- W(m·k) |
Adhesive Type | Feature/Application |
|---|---|---|---|---|---|---|---|---|---|
| SG 8101 | 50 | Single-sided | Copper Foil | >12 | Natural | 280 | 280 | Acrylic |
Designed for heat distribution applications on the electronic devices |
| SG 8102 | 70 | >12 | |||||||
| SG 8103 | 80 | >12 | |||||||
| SG 8104 | 100 | >15 | |||||||
| SG 8105 | 150 | >15 | |||||||
| SG 8106 | 200 | >15 | |||||||
| SG 8111 | 30 | Single-sided | Copper Foil | >15 | Natural | ≥ 350 | ≥ 350 |
Thermal Adhesive |
|
| SG 8112 | 45 | >15 | |||||||
| SG 8113 | 100 | >15 | |||||||
| SG 8114 | 150 | >15 | |||||||
| TT Series | 100-500 | Double-sided | None | >10 | White | 1.5 | / |
Acrylic Adhesive with Ceramic Fillers |
Designed for bonding between a heat sink and a heat source in applications such as CPUs in notebook and desktop computers and other electronic devices |
Note: Customizable solution is available upon request
