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TIF Series Thermal Insulation Film
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Expected Annual Volume

DRG-01L Liquid Metal

Description

TIF Series Thermal Insulation Film is mainly composed of aerogel, which is the lightest solid material in the world and has the best performance in thermal insulation. The thermal conductivity of the film is as low as 0.02 W/m·K due to the absence of convection within the material.

Features

  • Super low thermal conductivity: 0.018~0.022W/m·K
  • Ultra-thin: 0.1~1.0mm
  • Compressible
  • Compliance with RoHS requirements
  • Long term stability and reliability
  • Easy for assembly

Applications

  • Notebook / PC
  • PCB/IC thermal protection
  • Wearable device
  • Telecommunication
  • Medical device
  • Consumer electronics
  • System level thermal design for
    electronic device

Coding Principle

Typical Properties

Item Unit TIF series Test Method
Composition / Aerogel & Resin /
Thickness mm 0.1~1.0 ASTM D374
Color / White Visual
Density g/cm³ 0.2 ASTM D792
Thermal Conductivity W/m·K 0.018 - 0.022 ASTM D5470
Dielectric Strength Kv/mm >10 ASTM D149
Volume Resistivity Ω·cm >10¹³ ASTM D257
Continuous Use Temperature -20~180 /

Thermal Insulation Performance

Note: 1. It is recommended to combine with graphite for thermal dissipation in application.
2. Dimensions and designs are customised according to practical application.

Suggestions for Thermal Design

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