TCP Series Thermally Conductive Putty

Polyplate^TM TCP Series Thermally Conductive Putty is a soft and compliant gap filler material with the thermal conductivity of 8.0 W/m·K. It can offer exceptional thermal performance at low pressure.

Tape Materials

Tapes

Thermal Materials

Thermal Interface Materials (TIMs)

Thermal Spreading Sheet

Nano Thermal Insulation Film

TIF Series Ultra-thin Nano Thermal Insulation Film

EMI/EMC Materials

EMI Shielding and Grounding Tapes

EMI Shielding and Grounding Gaskets

Electromagnetic Wave Absorbing Solutions

Foam Materials

Polyurethane (PU) Foam

Acrylic Foam

PA Series Acrylic Foam

Water-Proof Foam

FPT Series Waterproof Foam Tape
AFT Series Waterproof Foam Tape

Light-Blocking Foam

PF-S3B Series Light-Blocking Foam
80160 Series Light-Blocking Foam

Acoustic Damping Foam

Melamine Foam
PS-DF Microcellular Damping Foam

Silicone Foam

SF-S2 Series Microcellular Silicone Foam

Conductive Foam

Label Materials

Labels

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