Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
PolyplateTM TSP-S Series Thermally Conductive Pad is a soft and compliant gap filler material. It can offer exceptional thermal performance at low pressure. PolyplateTM TSP-LD Series Thermally Conductive Pad is a low-density thermal conductive gasket suitable for applications with light-weight requirements.
| Item | Unit | TSP80S | TSP30LD | Test Method |
|---|---|---|---|---|
| Composition | / | Silicone & Ceramic | / | |
| Color | / | Brown | White | Visual |
| Thickness | mm | 0.5~10.0 | ASTM D374 | |
| Density | g/cm³ | 3.3 | 1.7 | ASTM D792 |
| Hardness | Shore 00 | 35 | 30 | ASTM D2240 |
| Dielectric Strength | KV/mm | >6.0 | ASTM D147 | |
| Volume Resistivity | Ω·cm | 1013 | ASTM D257 | |
|
Continuous Use Temperature |
°C | -40~150 | / | |
| Weight Loss | % | <0.5 | @150℃240H | |
| Flame Rating | / | V0 | UL 94 | |
| Thermal Conductivity | W/m·K | 8.0 | 3.0 | ASTM D5470 |
| Dielectric Constant@1MHz | / | 6.6 |
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