Thermal conductivity 0.5~8W/m.K
Soft
No resiliency after press
Thermal conductivity 1W/m.K ~12W/m.K
Low oil bleeding
Dispensing
Thermal conductivity 3.5/4.5/6.5W/m.K
Suface wettablity enhanced when phase changes
Thermal conductivity 1W/m.K ~6W/m.K
Good flowability and wettability
Extremely high K
Electrically conductive
Offer bonding performance and thermal conductivity
Excellent compression performance
Excellent XY axis thermal spreading performance
Excellent XY axis thermal spreading performance and cushion performance
Both electrically and thermally conductive
Ultra-low thermal conductivity
Protect IC from heat shocking
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
