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EMI/EMC Materials

Home > Products > EMI/EMC Materials > EMI Shielding and Grounding Gaskets > WP Series Conductive PI Over Foam
WP Series Conductive PI Over Foam
ShielditeTM WP series conductive PI over foam materials consist of a highly conductive Cu/Ni Plated PI, a PU foam core, and a conductive pressure-sensitive acrylic adhesive. These highly compressible materials are specifically designed to provide excellent EMI shielding and grounding performance coupled with high degree dust and moisture protection. WP series products are particularly suitable for fixed-gasket applications within computers, smartphones, LCDs/TVs and telecommunication manufacturing sectors as they are easily trimmed to size. Reflow solderable gasket can be customised by request.
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