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Thermal Activated Tape
SG offers a variety of adhesive tapes made of PET, Non-woven, Foam, PI substrates coated with acrylic, silicone, rubber, hot melting, thermal transform adhesive. Available in variety of widths, lengths and release liners for specific needs, designed for special environment in industry, commerce and family applications.
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Product P/N Total Thickness
(um) 		Type Carrier Bonding Strength MPa SUS/SUS Soft Point (℃） Color Adhesive Type Pre-Lamination Recommended Bonding Conditions Feature/Application
HT Series
HT6501 10 Double-sided E >2 50-70 Transparent Thermal
Setting 		Glue Line
Temperature.
50-70°C
Dwell Time:
5-15 Seconds
Pressure:
2-4 Bar 		Glue Line
Temperature:
min.120°C
Dwell Time:
30-120 Seconds
Pressure:
2.8-5 Bar
1.Weak adhesion at room temperature, good adhesion to metal, glass and PI after curing
2.Good impact performance and heat/moisture resistance
3.No further post-curing is required after thermal activation during bonding
HT2013P 130 Single-sided  PI/PET >7 Amber/Black
Thermal
Setting
2 kg rubber hand roller 5 mm/s, 3 times in each direction
 150℃*10min+180℃*20min Electrical insulation;Cooling Plate
HT5601 10 Double-sided none >3 90-120 Transparent Thermal
Setting 		Glue Line
Temperature.
35-130°C
Dwell Time:
5-30 Seconds
Pressure:
3-11 Bar 		Glue Line
Temperature:
170-200°C
Dwell Time:
10-30 min
Pressure:
3-11 Bar
1.High temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
4.Easy handling performance for die cutting
HT5602 20 Double-sided none >4 90-120 Transparent Thermal
Setting 		Glue Line
Temperature.
35-130°C
Dwell Time:
5-30 Seconds
Pressure:
3-11 Bar 		Glue Line
Temperature:
170-200°C
Dwell Time:
10-30 min
Pressure:
3-11 Bar
1.High temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
4.Easy handling performance for die cutting
HT5610 100 Double-sided none ＞20 90-120 Transparent Thermal
Setting 		Glue Line
Temperature.
50-70°C
Dwell Time:
5-15 Seconds
Pressure:
2-4 Bar 		Glue Line
Temperature:
180-200°C
Dwell Time:
10-30 min
Pressure:
2-5 Bar
1.High temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
4.Easy handling performance for die cutting
LT Series
LT0100B 100 Double-sided none >5 45-60  Black Thermal
Setting 		Glue Line
Temperature.
50-60°C
Dwell Time:
5-15 Seconds
Pressure:
2-4 Bar 		Glue Line
Temperature:
min.75°C
Dwell Time:
30-120 Seconds
Pressure:
2.8-5 Bar
1. Extremely strong bonding for leather, PC. metal, etc.
2. Activated at low temperature and pressure
3. Thermal setting type, can't be re-activated
LU Series
LU2305 50 Double-sided none >10 / Transparent UV
Setting 		2 kg rubber hand roller 5 mm/s, 3 times in each direction
 70mW 365nm LED@60sec  70℃@3hrs
1.Tackiness at room temperature for handling
2.UV curing of opaque substrates
3.Can be heat accelerated to reduce curing time
4.Have good strength and reliability on metals, plastics, textiles, and glass
LU2311L 110 Single-sided  PET >5 / Blue UV
Setting 		2 kg rubber hand roller 5 mm/s, 3 times in each direction
 70mW 365nm LED@60sec  70℃@3hrs
 Electrical insulation
TP Series
TP3002 20 Double-sided none >2 90-120 Transparent Thermal
Setting 		Glue Line
Temperature.
50-70°C
Dwell Time:
5-15 Seconds
Pressure:
2-4 Bar 		Glue Line
Temperature:
min.140°C
Dwell Time:
30-120 Seconds
Pressure:
2.8-5 Bar
1.Weak adhesion at room temperature, good adhesion to metal, glass and PI after curing
2.Good impact performance and heat/moisture resistance
3.No further post-curing is required after thermal activation during bonding
4.Zero emissions, zero VOC
TL Series
TL5010 100 Double-sided none >2 50-80 Transparent Thermal
Setting 		Glue Line
Temperature.
25-70°C
Dwell Time:
5-15 Seconds
Pressure:
1-5 Bar 		Glue Line
Temperature:
70-100°C
Dwell Time:
5-60 s
Pressure:
1-5 Bar
1.Tack at room temperature applicable as a pressure sensitive tape
2.Outstanding resistance against heat and chemicals
3.Good adhesion on SUS, AL, PI, PC, Glass and black coating Glass after activation.
4.Easy handling performance for die cutting
TL5025B 250 Double-sided none >2 50-80 Black Thermal
Setting 		Glue Line
Temperature.
25-70°C
Dwell Time:
5-15 Seconds
Pressure:
1-5 Bar 		Glue Line
Temperature:
70-100°C
Dwell Time:
5-60 s
Pressure:
1-5 Bar
1.Tack at room temperature applicable as a pressure sensitive tape
2.Outstanding resistance against heat and chemicals
3.Good adhesion on SUS, AL, PI, PC, Glass and black coating Glass after activation.
4.Easy handling performance for die cutting
EM Series 50-100 Double-sided Cu/none >7 90-120 Brownish red Thermal
Setting 		Glue Line
Temperature.
50-70°C
Dwell Time:
5-15 Seconds
Pressure:
2-4 Bar 		Glue Line
Temperature:
180-200°C
Dwell Time:
10-30 min
Pressure:
2-5 Bar
1.High temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
4.Easy handling performance for die cutting
5.Good conductivity
TM Series 50-100 Double-sided none >7 90-120 White Thermal
Setting 		Glue Line
Temperature.
50-70°C
Dwell Time:
5-15 Seconds
Pressure:
2-4 Bar 		Glue Line
Temperature:
180-200°C
Dwell Time:
10-30 min
Pressure:
2-5 Bar
1.High temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
4.Easy handling performance for die cutting
5.Good thermal conductivity

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