Synthetic Graphite is a thin high performance product that can help you with your thermal management challenges.
Silicone thermal pads are cost effective thermal conductive solutions with low compression force, low thermal resistance, ultra-soft performance and high conformability for applications. They are used for filling the air gap between the electronic component and heat sink. They offer high compressibility, tacky surface, softness and flexibility. SG has a range of product options in thermal conductivity from 1.5W/m.k to 17W/m.k.
Silicone-free thermal pads provides a thermal solution for filling the air gap between the silicone oil sensitive electronic component and heat sink. It offers high compressibility, tacky surface, softness and flexibility. These kinds of thermal pads can avoid the electronic component polluted by silicone oil, or makes the dust stick on it, to keep it nice and clean.
Thermally conductive putty is a kind soft and compliant gap filling material with a thermal conductivity of 8.0 W/m.K, and can offer exceptional thermal performance at low pressures.
Thermally conductive silicone sheets are specially designed for applications which need excellent heat transfer, insulation and voltage resistance. The insulators have a smooth and non-tacky surface for reposition and reuse，which is ideal for gap filling between electronic power devices and a heatsink for screw and clip mounted applications.
Thermal phase change material (TPCM) is designed to meet the thermal reliability and price requirements of high-end thermal applications. The series are inherently tacky, Flexible and exceptionally easy-to-use.They can fill irregular surfaces between electronic component and heat sink.
Thermally conductive gel is a pre-curing and compliant new thermally interface material. And the material can conform to multiple component heights, and offer excellent thermal performance and low contact thermal resistance.
Thermal grease is high thermal conductivity and low thermal resistance compound for components that require improved thermal dissipation. It is ideally suited for use in CPU, GPU cooling and other applications between power semiconductor components and heatsinks where thermal resistance is the major concern.
Thermally conductive tape is a kind of acrylic pressure-sensitive adhesive loaded with high thermally Conductive ceramic fillers. It improves the heat conduction between heat-generating components and heat sinks due to its good thermal conductivity. For its excellent adhesive performance and low thermal resistance, it can replace thermal grease and mechanically fixing method.
SG PolylateTM TCF Series thermally conductive foam gasket is a kind of thermally conductive gasket that consists of PU foam wrapped with synthetic graphite on four sides.
TIF series ultra-thin nano thermal insulation film is mainly composed of aerogel, which is the lightest solid material in the world and has the best performance in thermal insulation. The thermal conductivity of the film is as low as 0.02 W/(m.K) due to the absence of convection within the material.
TSS series thermal spreading sheet is a specially designed composite thermal material which has a structure of different functional layers for thermal solutions. It provides excellent heat conducting, spreading and cooling performance. It is also a good choice as an EMI shielding solution.
Thermally conductive shocking absorber is a specially designed composite material for both thermal and shocking absorption solutions of LCM. The synthetic graphite layer provides excellent heat spreading and cooling performance. The foam layer that is coated directly on the graphite sheet is super soft, slowly rebound and offers excellent cushioning and long-term gap filling in electronic devices.